Samsung collaborated with Apple on M2 chip

In April 2022, reports indicated that Samsung Electro-Mechanics was collaborating with Apple Inc. on components for the upcoming M2 chip, specifically by supplying Flip-Chip Ball Grid Array substrates. The reports noted that while Apple’s M series processors are fabricated by Taiwan Semiconductor Manufacturing Company, the FC-BGA substrate forms a critical layer connecting the processor die to the system board. This component supports high density interconnections and heat management required for modern system on chip designs used in Mac computers and other Apple devices. Industry coverage stated that Samsung Electro-Mechanics had previously supplied FC-BGA substrates for Apple’s M1 chip and was selected again for the M2 due to production yield and manufacturing quality. The FC-BGA substrate is a specialized printed circuit board that enables fine pitch wiring and power delivery between the silicon die and the motherboard. Analysts noted that demand for FC-BGA substrates had increased across the semiconductor industry due to rising complexity in processors used in laptops, servers, and mobile devices. To support expected demand, Samsung Electro-Mechanics reportedly invested about $1.3 billion, equivalent to approximately KRW 1.6 trillion, to expand FC-BGA production capacity in facilities located in Vietnam and South Korea. The expansion was intended to increase output for high performance computing customers, including Apple. The collaboration was reported ahead of Apple’s June 2022 announcements, when the company introduced M2 powered devices including the redesigned MacBook Air and the 13 inch MacBook Pro at the Worldwide Developers Conference.